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Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips

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Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips

Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Product Paramenters
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
MAX3221IDBR
MSP430 Family: Low-Cost, Low-Power, Versatile Embedded 16-bit MCUs TMS320 Series: 16/32-bit MCU family optimized for real-time control applications 16-bit, whole-point arithmetic, 20 to 40 MHz C28X: 32-bit, integer or floating-point arithmetic, 100 to 150 MHz digital signal processor TMS320 series TMS320C2xxx: 16- and 32-bit digital signal processors optimized for control applications TMS320C5xxx: 16-bit full-point low-power processor, 100 to 300 MHz TMS320C6xxx: High Performance Digital Signal Processor Family, 300 to 1000 Hz Other models include TMS320C33, TMS320C3x, TMS320C4x, TMS320C5x, and TMS320C8x, as well as OMAP series of multi-core processors based on ARM architecture designed for mobile devices, such as ARM9, ARM11, and Cortex-A8.
Manufacturer:
Texas Instruments
Product Category:
Microprocessors - MPU
RoHS:
Details
Mounting Style:
SMD/SMT
Package / Case:
PBGA-324
Series:
AM3352
Core:
ARM Cortex A8
Number of Cores:
1 Core
Data Bus Width:
32 bit
Maximum Clock Frequency:
1 GHz
L1 Cache Instruction Memory:
32 kB
L1 Cache Data Memory:
32 kB
Operating Supply Voltage:
1.325 V
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 125 C
Packaging:
Tray
Brand:
Texas Instruments
Data RAM Size:
64 kB, 64 kB
Data ROM Size:
176 kB
Development Kit:
TMDXEVM3358
I/O Voltage:
1.8 V, 3.3 V
Interface Type:
CAN, Ethernet, I2C, SPI, UART, USB
L2 Cache Instruction / Data Memory:
256 kB
Memory Type:
L1/L2/L3 Cache, RAM, ROM
Moisture Sensitive:
Yes
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Our Advantages
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Company Profile
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Recommend Products
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Manufacturing Technique
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
FAQ
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips

FAQ

Q1:About the quotation of IC BOM?
A1:The company has the procurement channels of original integrated circuit manufacturers at home and abroad and a professional product solution analysis team to select high-quality, low-cost electronic components for customers. Q2:Quotation for PCB and PCBA solutions?
A2: The company's professional team will analyze the application range of the PCB and PCBA solutions provided by the customer and the parameter requirements of each electronic component, and ultimately provide customers with high-quality and low-cost quotation solutions.
Q3:About chip design to finished product?
A3: We have a complete set of wafer design, wafer production, wafer testing, IC packaging and integration,and IC product inspection services.
Q4:Does our company have a minimum order quantity (MOQ) requirement?
A4: No, we do not have MOQ requirement, we can support your projects starting from prototypes to mass productions.
Q5:How to ensure that customer information is not leaked?
A5: We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level.
Texas/TI MAX3221IDBR Electronic Components Fpga Integrated Circuits Microcontroller Experiment Kit MAX3221IDBR IC chips
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